A heat sink and fan (HSF) is an active cooling solution used to cool down integrated circuits in computer systems, commonly the central processing unit (CPU). As the name suggests, it is composed of a passive cooling unit (the heat sink) and a fan

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OEM extrusion machined heat sink with fan for cooling solution

  • MOQ: Any quantity
    Payment: 50% deposit 50% balance in advance
    Delivery time :15-30 days
    FOB Port: SHENZHEN
    Certification: IS09001
  • Quality control:100% inspected